AK4650 Datasheet, PDF (84/86 Pages) Asahi Kasei Microsystems – 16Bit ΔΣ CODEC with MIC/HP/SPK-AMP & TSC

57pin BGA (Unit: mm)
5.0 ± 0.1
PACKAGE
[AK4650]
57 - φ 0.3 ± 0.05
φ 0.05 M S AB
0.5
9 8 7 65 4 3 2 1
A
B
B
C
D
E
F
G
H
J
0.5
S
0.08 S
■ Material & Lead finish
Package molding compound:
Interposer material:
Solder ball material:
Epoxy
BT resin
SnAgCu
MS0502-E-01
- 84 -
2007/04