AM1705DPTPA3 Datasheet, PDF (35/164 Pages) Texas Instruments – AM1705 ARM Microprocessor

AM1705
www.ti.com
SPRS657D – FEBRUARY 2010 – REVISED MARCH 2013
4.2 Recommended Operating Conditions
CVDD
RVDD
DVDD
VSS
V_IH ⁽²⁾
V_IL ⁽²⁾
V_HYS
t_t
F_SYSCLK6
Supply voltage, Core
(CVDD, PLL0_VDDA )
375 MHz version
456 MHz version
Supply Voltage, Internal RAM
375 MHz version
456 MHz version
Supply voltage, I/O, 1.8V
(USB0_VDDA18)
Supply voltage, I/O, 3.3V
(DVDD, USB0_VDDA33)
Supply ground
(VSS, PLL0_VSSA, OSCVSS⁽¹⁾)
High-level input voltage, I/O, 3.3V
High-level input voltage, OSCIN
Low-level input voltage, I/O, 3.3V
Low-level input voltage, OSCIN
Input Hysteresis
Transition time, 10%-90%, All Inputs (unless otherwise specified in
the electrical data sections)
ARM Operating Frequency (SYSCLK6)
Commercial (default)
Industrial (D suffix)
Extended (A suffix)
MIN
1.14
1.25
1.14
1.25
1.71
3.0
0
2
0.7*CVDD
0
0
0
NOM
1.2
1.3
1.2
1.3
1.8
3.3
0
160
MAX
1.32
1.35
1.32
1.35
1.89
3.45
0
0.8
0.3*CVDD
0.25P or 10 ⁽³⁾
375 (1.2V)
456 (1.3V)
456 (1.3V)
375(1.2V)
UNIT
V
V
V
V
V
V
V
V
V
V
V
mV
ns
MHz
MHz
MHz
(1) When an external crystal is used, oscillator (OSC_VSS) ground must be kept separate from other grounds and connected directly to the
crystal load capacitor ground. These pins are shorted to VSS on the device itself and should not be connected to VSS on the circuit
board. If a crystal is not used and the clock input is driven directly, then the oscillator VSS may be connected to board ground.
(2) These I/O specifications do not apply to USB I/Os. USB0 I/Os adhere to USB2.0 specification.
(3) Whichever is smaller. P = the period of the applied signal. Maintaining transition times as fast as possible is recommended to improve
noise immunity on input signals.
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Device Operating Conditions
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