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XC4000 Datasheet, PDF (2/22 Pages) Xilinx, Inc – Third Generation Field-Programmable Gate Arrays
XC4000 Logic Cell Array Family
Absolute Maximum Ratings
Symbol Description
Units
VCC Supply voltage relative to GND
–0.5 to +7.0
V
VIN
Input voltage with respect to GND
–0.5 to VCC +0.5
V
VTS Voltage applied to 3-state output
–0.5 to VCC +0.5
V
TSTG Storage temperature (ambient)
–65 to + 150
°C
TSOL Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
+ 260
°C
TJ
Junction temperature
+ 150
°C
Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those listed under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings
conditions for extended periods of time may affect device reliability.
Operating Conditions
Symbol Description
Min Max Units
VCC
Supply voltage relative to GND Commercial 0°C to 85°C junction
4.75 5.25 V
Supply voltage relative to GND Industrial -40°C to 100°C junction
4.5 5.5
V
Supply voltage relative to GND Military –55°C to 125°C case
4.5 5.5
V
VIH
High-level input voltage (XC4000 has TTL-like input thresholds)
2.0 VCC
V
VIL
Low-level input voltage (XC4000 has TTL-like input thresholds)
0
0.8 V
TIN
Input signal transition time
250 ns
At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.35% per °C.
DC Characteristics Over Operating Conditions
Symbol Description
Min Max Units
VOH
High-level output voltage @ IOH = –4.0 mA, VCC min
VOL
Low-level output voltage @ IOL = 12.0 mA, VCC min (Note 1)
ICCO
Quiescent LCA supply current (Note 2)
IIL
Leakage current
CIN
Input capacitance (sample tested)
IRIN
Pad pull-up (when selected) @ VIN = 0V (sample tested)
IRLL
Horizontal Long Line pull-up (when selected) @ logic Low
2.4
V
0.4 V
10
mA
–10 +10
µA
15
pF
0.02 0.25 mA
0.2 2.5 mA
Note: 1. With 50% of the outputs simultaneously sinking 12 mA.
2. With no output current loads, no active input or longline pull-up resistors, all package pins at VCC or GND, and
the LCA configured with a MakeBits tie option.
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