DS90CF366_16 Datasheet, PDF (7/38 Pages) Texas Instruments – DS90CF3x6 3.3-V LVDS Receiver 24-Bit Or 18-Bit Flat Panel Display (FPD) Link, 85 MHz

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6 Specifications
DS90CF366, DS90CF386
SNLS055J – NOVEMBER 1999 – REVISED MAY 2016
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage, V_CC
CMOS/LVCMOS output voltage
LVDS receiver input voltage
Power dissipation capacity at 25°C
Lead temperature
Operating junction temperature, T_J
Storage temperature, T_stg
DS90CF366, TSSOP package
DS90CF386
TSSOP soldering (4 s)
NFBGA soldering, reflow (20 s)
TSSOP package
NFBGA package
MIN
MAX
UNIT
–0.3
4
V
–0.3
V_CC + 0.3
V
–0.3
V_CC + 0.3
V
1.61
1.89
W
2
260
°C
220
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±7000
±700
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
V_NOISE
T_A
Supply voltage
Receiver input
Supply noise voltage
Operating free-air temperature
MIN
NOM
MAX UNIT
3
3.3
3.6
V
0
2.4
V
100 mV_PP
–10
25
70
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DS90CF366
DGG (TSSOP)
DS90CF386
DGG (TSSOP) NZC (NFBGA)
UNIT
48 PINS
56 PINS
64 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
67.8
64.6
65.7
°C/W
22.1
20.6
23.8
°C/W
34.8
33.3
44.9
°C/W
1.1
1
1
°C/W
34.5
33
44.9
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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