LP3907 Datasheet, PDF (6/58 Pages) National Semiconductor (TI) – Dual High-Current Step-Down DC/DC and Dual Linear Regulator with I2C Compatible Interface

LP3907
SNVS511S – JUNE 2007 – REVISED APRIL 2016
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
V_IN, SDA, SCL
GND to GND SLUG
Power dissipation (WQFN (RTW))(P_{D_MAX}) (T_A = 85°C, T_MAX = 125°C )⁽³⁾
Power dissipation (DSBGA (YZR))⁽³⁾ (P_{D_MAX}) (T_A = 85°C, T_MAX = 125°C )
Junction temperature, T_J-MAX
Maximum lead temperature (soldering)
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
6
V
±0.3
V
1.43
W
0.78
W
150
°C
260
°C
−65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions (Bucks). Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP − (R_θJA × P_D-MAX).
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2000
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions (Bucks)
over operating free-air temperature range (unless otherwise noted)^(1)(2)(3)(4)
V_IN
V_EN
Junction temperature, T_J
Ambient temperature, T_A(5)
MIN
MAX
UNIT
2.8
5.5
V
0
(V_IN + 0.3 V)
V
−40
125
°C
−40
85
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) Minimum (Minimum) and Maximum (Maximum) limits are ensured by design, test, or statistical analysis. Typical numbers are not
ensured, but do represent the most likely norm.
(4) Buck V_IN ≥ V_OUT + 1 V.
(5) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
6
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