DRV8704 Datasheet, PDF (5/38 Pages) Texas Instruments – Dual H-Bridge PWM Gate Driver

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6 Specifications
DRV8704
SLVSD29 – OCTOBER 2015
6.1 Absolute Maximum Ratings
over operating free-air temperature range referenced with respect to GND (unless otherwise noted) ⁽¹⁾
MIN
MAX
Power supply voltage (VM)
–0.6
60
Charge pump voltage (CP1, CP2, VCP)
–0.6
VM + 12
5-V regulator voltage (V5)
–0.6
5.5
Internal regulator voltage (VINT)
–0.6
2.0
Digital pin voltage (SLEEPn, RESET, AIN1, AIN2, BIN1, BIN2, SCS, SCLK, SDATI,
SDATO, FAULTn)
–0.6
5.5
High-side gate drive pin voltage (A1HS, A2HS, B1HS, B2HS)
–0.6
VM + 12
Low-side gate drive pin voltage (A1LS, A2LS, B1LS, B2LS)
–0.6
12
Phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2)
–0.6
VM
ISENSEx pin voltage (AISENP, AISENN, BISENP, BISENN)
–0.7
+0.7
Operating virtual junction temperature, T_J
Storage temperature, T_stg
–40
150
–60
150
UNIT
V
V
V
V
V
V
V
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101 ⁽²⁾
VALUE
±4000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
VM
V_IN
f_PWM
I_V5
T_A
Motor power supply voltage range
Digital pin voltage range
Applied PWM signal (xINx)
V5 external load current
Operating ambient temperature range
MIN
MAX
UNIT
8
52
V
0
5.3
V
0
500
kHz
0
10
mA
–40
85
°C
6.4 Thermal Information
THERMAL METRIC ⁽¹⁾
DRV8704
DCP (HTSSOP)
UNIT
38 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
32.7
°C/W
17.2
°C/W
14.3
°C/W
0.5
°C/W
14.1
°C/W
0.9
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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