OMAP3515DCBC Datasheet, PDF (259/264 Pages) Texas Instruments – OMAP3515/03 Applications Processor

PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2012
Orderable Device
OMAP3515DCUS72
OMAP3515DCUSA
OMAP3515ECBB
OMAP3515ECBBA
OMAP3515ECBC
OMAP3515ECBCA
OMAP3515ECUS
OMAP3515ECUS72
OMAP3515ECUSA
Status ^{(1) Package Type Package}
Drawing
OBSOLETE
OBSOLETE
FCBGA
FCBGA
CUS
CUS
Pins
423
423
Package Qty
ACTIVE POP-FCBGA CBB
515
168
ACTIVE POP-FCBGA CBB
515
168
ACTIVE POP-FCBGA CBC
515
119
ACTIVE POP-FCBGA CBC
515
119
ACTIVE
FCBGA
CUS
423
90
ACTIVE
FCBGA
CUS
423
90
ACTIVE
FCBGA
CUS
423
90
Eco Plan ⁽²⁾
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
Call TI Call TI
SNAGCU Level-4-260C-72 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
Call TI
Call TI
SNAGCU
Call TI
Call TI
Level-4-260C-72 HR
SNAGCU Level-4-260C-72 HR
SNAGCU Level-4-260C-72 HR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 2