CC2500_06 Datasheet, PDF (79/84 Pages) Texas Instruments – Single Chip Low Cost Low Power RF Transceiver

32.1 Recommended PCB layout for package (QLP 20)
CC2500
Figure 30: Recommended PCB layout for QLP 20 package
Note: The figure is an illustration only and not to scale. There are five 10 mil diameter via holes
distributed symmetrically in the ground pad under the package. See also the CC2500EM
reference design.
32.2 Package thermal properties
Thermal resistance
Air velocity [m/s]
0
Rth,j-a [K/W]
40.4
Table 39: Thermal properties of QLP 20 package
32.3 Soldering information
The recommendations for lead-free reflow in IPC/JEDEC J-STD-020C should be followed.
32.4 Tray specification
CC2500 can be delivered in standard QLP 4x4 mm shipping trays.
Tray Specification
Package
Tray Width
QLP 20
135.9 mm
Tray Height
7.62 mm
Tray Length
322.6 mm
Table 40: Tray specification
Units per Tray
490
PRELIMINARY Data Sheet (Rev.1.2) SWRS040A
Page 79 of 83