SMJ320C6701_07 Datasheet, PDF (61/64 Pages) Texas Instruments – FLOATING-POINT DIGITAL SIGNAL PROCESSOR

GLP (S-CBGA-N429)
SMJ320C6701
FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR
MECHANICAL DATA
SGUS030B – APRIL 2000 – REVISED MAY 2001
CERAMIC BALL GRID ARRAY
27,20
26,80 ^SQ
1,22
1,00
25,40 TYP
1,27
AA
Y
W
V
U
T
R
P
N
1,27
M
L
K
J
H
G
F
E
D
C
B
A
1 3 5 7 9 11 13 15 17 19 21
2 4 6 8 10 12 14 16 18 20
3,30 MAX
0,90
0,60
∅ 0,10 M
Seating Plane
0,70
0,15
0,50
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-156
D. Flip chip application only
thermal resistance characteristics (S-CBGA package)
NO
1 RΘ_JC Junction-to-Case, measured to the bottom of solder ball
2 RΘ_JC Junction-to-Case, measured to the top of the package lid
3 RΘ_JA Junction-to-Ambient
4
5 RΘ_JMA Junction-to-Moving-Air
6
Junction-to-Board, measured by soldering a thermocouple to one of the middle
7 RΘ_{JB traces on the board at the edge of the package}
4164732/A 08/98
°C/W
3.0
7.3
14.5
11.8
11.1
10.2
6.2
Air Flow
N/A
N/A
0
150 fpm
250 fpm
500 fpm
N/A
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