OMAP5910JZZG2 Datasheet, PDF (120/171 Pages) Texas Instruments – This document has been reviewed for technical accuracy; the technical content is up-to-date as of the specified release date and includes the following changes

Documentation Support
4.1 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
OMAP™ processors and support tools. Each commercial OMAP platform member has one of three prefixes:
X, P, or null (no prefix). Texas Instruments recommends two of three possible prefix designators for its support
tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMDX) through fully qualified production devices/tools (TMDS).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device’s electrical
specifications and may not use production assembly flow. (TMX definition)
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet final
electrical specifications. (TMP definition)
null Production version of the silicon die that is fully qualified. (TMS definition)
Support tool development evolutionary flow:
TMDX Development support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS Fully qualified development support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
Production devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (X or P), have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because
their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
For additional description of the device nomenclature markings, see the OMAP5910 Dual-Core Processor
Silicon Errata (literature number SPRZ016).
P OMAP 5910 X GZG S
PREFIX
X Experimental device
P Prototype device
null Production device
DEVICE
SILICON REVISION
TEMPERATURE RANGE
NULL = --40°C to 85°C Case
C = 0°C to 85°C Case
SPEED GRADE
2 = 150 MHz
PACKAGE TYPE
GZG = 289-pin MicroStar BGA
ZZG = Lead-Free 289-pin MicroStar BGA
GDY = 289-pin BGA
Figure 4--1. OMAP Device Nomenclature
120 SPRS197D
August 2002 -- Revised August 2004