TDA7546 Datasheet, PDF (66/68 Pages) STMicroelectronics – Multichip module for TMC tuner applications

Package information
9
Package information
TDA7546
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 26. TQFP80LS mechanical data & package dimensions
mm
DIM.
inch
MIN. TYP. MAX. MIN. TYP. MAX.
A
1.60
0.063
A1 0.05
0.15 0.002
0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.22 0.32 0.38 0.009 0.013 0.015
C 0.09
0.20 0.003
0.008
D
16.00
0.630
D1
14.00
0.551
D3
12.35
0.295
e
0.65
0.0256
E
16.00
0.630
E1
14.00
0.551
E3
12.35
0.486
L 0.45 0.60 0.75 0.018 0.024 0.030
L1
1.00
0.0393
K
3.5°(min.), 7°(max.)
OUTLINE AND
MECHANICAL DATA
LQFP80
(14x14x1.40mm)
D
D1
D3
60
61
e
B
PIN 1
IDENTIFICATION
80
1
41
40
0.10mm
.004
Seating Plane
A
A2
A1
E3 E1 E
Gage plane
0.25mm
21
20
K
C
TQFP80L
L
L1
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