STE2004 Datasheet, PDF (65/66 Pages) STMicroelectronics – 102 X 65 SINGLE CHIP LCD CONTROLLER / DRIVER

STE2004
Figure 76. Alignment marks dimensions
94 µm
39 µm
Table 30. Bumps
Bumps Size
Pad Size
Pad Pitch
Spacing between
Bumps
Bump
Number
Dimensions
30µm X 98 µm X 17.5
43µm X 107µm
50µm
20µm
Table 31. Die Mechanical Dimensions
Die Size (X x Y)
6.42mm x 1.46mm
Wafers Thickness
500µm
Table 32. Revision History
Date
Revision
May 2004
3
July 2004
4
Description of Changes
Moved the value of FSCLK parameter from Min. to Max. on the page 60/
66.
Inserted Table 24 -N-Line Inversion in the page 44/66
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