LSM330D Datasheet, PDF (64/66 Pages) STMicroelectronics – Low power mode

Package information
9
Package information
LSM330D
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Table 111. LGA-28L (3x5.5x1.0 mm) mechanical data
Dim.
Min.
mm
Typ.
A1
A2
0.785
A3
D1
2.850
0.200
3.000
E1
5.350
5.500
L1
4.050
L2
1.350
N1
0.450
M
0.060
0.100
P1
2.500
P2
1.250
T1
0.400
T2
0.250
d
0.200
k
0.050
Max.
1
3.150
5.650
0.140
Figure 23. LGA-28L (3x5.5x1.0 mm) drawing
E1
A
K
(4x)
B
E
D
KE
A3
KC
A2
A1
seating plane
K
E
L1
==
N1
P1
D
19 20 21 22 23 24 25 26 27 28
18
1
17
2
16
3
15
4
14 13 12 11 10 9 8 7 6 5
M
T2
BOTTOM VIEW
8340949_B
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Doc ID 022562 Rev 2