LSM330D Datasheet, PDF (31/66 Pages) STMicroelectronics – Low power mode

LSM330D
5
Application hints
Figure 13. LSM330D electrical connection
Application hints
Vdd_IO
C3
100 nF
GND
19
INT1_A 18
INT2_A
INT1_G
DRDY_G 15
14
Vdd
LSM330D
(BOTTOM VIEW)
FILTVDD
FILTIN Y
28
1
4
5
RES
RES
RES
RES
YZ
X
1
DIRECTION OF
DETECTABLE
ACCELERATIONS
Z
+ Ω_Y
X
+ Ω_z
1
+Ω_X
X
C1
100 nF
GND
C2
10 µF
GND
GND
DIRECTION OF
DETECTABLE
ANGULAR RATE
Digital signal from/to signal controller.Signals levels are defined by proper selection of Vdd
AM10233V1
5.1
External capacitors
The device core is supplied through Vdd line. Power supply decoupling capacitors (C1=C3 =
100 nF ceramic, C2=10 µF Al) should be placed as near as possible to the supply pin of the
device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 13). The functionality of the device and the measured
acceleration/angular rate data are selectable and accessible through the SPI/I²C interface.
The functions, the threshold and the timing of the two interrupt pins for each sensor can be
completely programmed by the user though the SPI/I²C interface.
5.2
Soldering information
The LGA package is compliant with ECOPACK^®, RoHS and “Green” standards. It is
qualified for soldering heat resistance according to JEDEC J-STD-020D.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
Doc ID 022562 Rev 2
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