LPS35HW Datasheet, PDF (3/48 Pages) STMicroelectronics – Embedded temperature compensation

LPS35HW
Contents
7 Registers address map ................................................................. 29
8 Register description ...................................................................... 31
8.1 INTERRUPT_CFG (0Bh) ................................................................ 31
8.2 THS_P_L (0Ch)............................................................................... 32
8.3 THS_P_H (0Dh) .............................................................................. 32
8.4 WHO_AM_I ..................................................................................... 32
8.5 CTRL_REG1 (10h).......................................................................... 33
8.6 CTRL_REG2 (11h).......................................................................... 34
8.7 CTRL_REG3 (12h).......................................................................... 35
8.8 FIFO_CTRL (14h) ........................................................................... 36
8.9 REF_P_XL (15h) ............................................................................. 37
8.10 REF_P_L_16h................................................................................. 37
8.11 REF_P_H_17h ................................................................................ 37
8.12 RPDS_L_18h .................................................................................. 38
8.13 RPDS_H_19h.................................................................................. 38
8.14 RES_CONF_1Ah ............................................................................ 38
8.15 INT_SOURCE_25h ......................................................................... 39
8.16 FIFO_STATUS_26h ........................................................................ 39
8.17 STATUS_27h .................................................................................. 40
8.18 PRESS_OUT_XL_28h .................................................................... 40
8.19 PRESS_OUT_L_29h ...................................................................... 42
8.20 PRESS_OUT_H_2Ah ..................................................................... 42
8.21 TEMP_OUT_L_2Bh ........................................................................ 42
8.22 TEMP_OUT_H_2Ch ....................................................................... 43
8.23 LPFP_RES_33h.............................................................................. 43
9 Package information ..................................................................... 44
9.1 CCLGA10L package information..................................................... 44
9.2 CCLGAA10L packing information ................................................... 45
10 Revision history ............................................................................ 47
DocID029129 Rev 1
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