LPS35HW Datasheet, PDF (21/48 Pages) STMicroelectronics – Embedded temperature compensation

LPS35HW
Application hints
5
Application hints
Figure 13: LPS35HW electrical connections (top view)
The device power supply must be provided through the VDD line; power supply decoupling
capacitor C1 (100 nF) must be placed as near as possible to the supply pads of the device.
Depending on the application, an additional capacitor of 4.7 µF could be placed on VDD
line.The functionality of the device and the measured data outputs are selectable and
accessible through the I²C/SPI interface. When using the I²C, CS must be tied to Vdd_IO.
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 13: "LPS35HW electrical connections (top view)"). It is
possible to remove VDD while maintaining Vdd_IO without blocking the communication
bus, in this condition the measurement chain is powered off.
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