SI53315 Datasheet, PDF (9/30 Pages) Silicon Laboratories – 1:10 LOW JITTER UNIVERSAL BUFFER/LEVEL

Si53315
Table 10. Thermal Conditions
Parameter
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Case
Symbol
_JA
_JC
Test Condition
Still air
Still air
Value
46.2
27.1
Unit
°C/W
°C/W
Table 11. Absolute Maximum Ratings
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Storage Temperature
T_S
Supply Voltage
V_DD
Input Voltage
V_IN
–55
–0.5
–0.5
—
150
C
—
3.8
V
—
V_DD+
V
0.3
Output Voltage
V_OUT
—
—
V_DD+
V
0.3
ESD Sensitivity
HBM
HBM, 100 pF, 1.5 kΩ
2000
—
—
V
ESD Sensitivity
CDM
500
—
—
V
Peak Soldering Reflow T_PEAK Pb-Free; Solder reflow profile per
—
Temperature
JEDEC J-STD-020
—
260
C
Maximum Junction
T_J
Temperature
—
—
125
C
Note: Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation
specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Preliminary Rev. 0.4
9