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C8051F85X86X Datasheet, PDF (19/290 Pages) Silicon Laboratories – Low-Cost 8-bit MCU Family with up to 8 kB of Flash | |||
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C8051F85x/86x
1.3. Thermal Conditions
Table 1.12. Thermal Conditions
Parameter
Symbol
Test Condition
Min
Typ
Thermal Resistance*
ï±JA
SOIC-16 Packages
QFN-20 Packages
â
TBD
â
TBD
QSOP-24 Packages
â
TBD
*Note: Thermal resistance assumes a multi-layer PCB with any exposed pad soldered to a PCB pad.
Max
â
â
â
Unit
°C/W
°C/W
°C/W
1.4. Absolute Maximum Ratings
Stresses above those listed under Table 1.13 may cause permanent damage to the device. This is a stress rating
only and functional operation of the devices at those or any other conditions above those indicated in the operation
listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect
device reliability.
Table 1.13. Absolute Maximum Ratings
Parameter
Symbol
Test Condition
Min
Typ
Max
Ambient Temperature Under Bias
Storage Temperature
TBIAS
TSTG
â55
125
°C
â65
150
°C
Voltage on VDD
VDD
Voltage on I/O pins or RST
VIN
Total Current Sunk into Supply Pin
Total Current Sourced out of Ground
Pin
Current Sourced or Sunk by Any I/O Pin
or RST
Power Dissipation at TA = 125 °C
IVDD
IGND
IPIO
PD
VDD > 3.3 V
VDD < 3.3 V
SOIC-16 Packages
QFN-20 Packages
QSOP-24 Packages
GNDâ0.3
GNDâ0.3
GNDâ0.3
â
400
-100
â
â
â
4.2
V
5.8
V
VDD+2.5
V
400
mA
â
mA
100
mA
TBD
mW
TBD
mW
TBD
mW
Preliminary Rev 0.6
19
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