K4B4G0446B Datasheet, PDF (12/59 Pages) Samsung semiconductor – DDP 4Gb B-die DDR3 SDRAM Specification

K4B4G0446B
K4B4G0846B
DDP 4Gb DDR3 SDRAM
6.0 Absolute Maximum Ratings
6.1 Absolute Maximum DC Ratings
[ Table 4 ] Absolute Maximum DC Ratings
Symbol
Parameter
Rating
Units
Notes
V_DD
V_DDQ
V_IN, V_OUT
T_STG
Voltage on V_DD pin relative to Vss
Voltage on V_DDQ pin relative to Vss
Voltage on any pin relative to Vss
Storage Temperature
-0.4 V ~ 1.975 V
-0.4 V ~ 1.975 V
-0.4 V ~ 1.975 V
-55 to +100
V
1,3
V
1,3
V
1
°C
1, 2
Note :
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2
standard.
3. V_DD and V_DDQ must be within 300mV of each other at all times;and V_REF must be not greater than 0.6 x V_DDQ, When V_DD and V_DDQ are less than
500mV; V_REF may be equal to or less than 300mV.
6.2 DRAM Component Operating Temperature Range
[ Table 5 ] Temperature Range
Symbol
Parameter
rating
Unit
Notes
T_OPER
Operating Temperature Range
0 to 95
°C
1, 2, 3
Note :
1. Operating Temperature T_OPER is the case surface temperature on the center/top side of the DRAM. For measurement conditions, please refer to the
JEDEC document JESD51-2.
2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case tem-
perature must be maintained between 0-85°C under all operating conditions
3. Some applications require operation of the Extended Temperature Range between 85°C and 95°C case temperature. Full specifications are guaran-
teed in this range, but the following additional conditions apply:
a) Refresh commands must be doubled in frequency, therefore reducing the refresh interval tREFI to 3.9us. It is also possible to specify a component
with 1X refresh (tREFI to 7.8us) in the Extended Temperature Range.
b) If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh mode with
Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the optional Auto Self-Refresh mode (MR2 A6 = 1b and MR2 A7 =
0b)
7.0 AC & DC Operation Conditions
7.1 Recommended DC operating Conditions (SSTL_1.5)
[ Table 6 ] Recommended DC Operating Conditions
Symbol
Parameter
Min.
V_DD
V_DDQ
Supply Voltage
Supply Voltage for Output
1.425
1.425
Note :
1. Under all conditions V_DDQ must be less than or equal to V_DD.
2. V_DDQ tracks with V_DD. AC parameters are measured with V_DD and V_DDQ tied together.
Rating
Typ.
1.5
1.5
Max.
1.575
1.575
Units
V
V
Notes
1,2
1,2
Page 12 of 59
Rev. 1.0 March 2009