TDA4841PS Datasheet, PDF (14/60 Pages) NXP Semiconductors – I2C-bus autosync deflection controller for PC monitors

Philips Semiconductors
I²C-bus autosync deflection controller for
PC monitors
Product specification
TDA4841PS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground.
SYMBOL
V_CC
V_i(n)
V_o(n)
V_I/O(n)
I_o(HDRV)
I_i(HFLB)
I_o(CLBL)
I_o(BOP)
I_o(BDRV)
I_o(EWDRV)
I_o(FOCUS)
T_amb
T_j
T_stg
V_esd
PARAMETER
supply voltage
input voltage
pin BIN
pins HSYNC, VSYNC, VREF, HREF, VSMOD and
HSMOD
pins SDA and SCL
pin XRAY
output voltage
pins VOUT2, VOUT1 and HUNLOCK
pins BDRV and HDRV
input/output voltages at pins BOP and BSENS
horizontal driver output current
horizontal flyback input current
video clamping pulse/vertical blanking output current
B+ control OTA output current
B+ control driver output current
EW driver output current
focus driver output current
ambient temperature
junction temperature
storage temperature
electrostatic discharge for all pins
CONDITIONS
note 1
note 2
MIN.
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−
−10
−
−
−
−
−
−20
−
−55
−150
−2 000
MAX.
UNIT
+16
V
+6.0
V
+6.5
V
+8.0
V
+8.0
V
+6.5
V
+16
V
+6.0
V
100
mA
+10
mA
−10
mA
1
mA
50
mA
−5
mA
−5
mA
+70
°C
150
°C
+150
°C
+150
V
+2000 V
Notes
1. Machine model: 200 pF; 0.75 µH; 10 Ω.
2. Human body model: 100 pF; 7.5 µH; 1500 Ω.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
R_th(j-a)
thermal resistance from junction to ambient
CONDITIONS
in free air
VALUE
55
UNIT
K/W
QUALITY SPECIFICATION
In accordance with “URF-4-2-59/601”; EMC emission/immunity test in accordance with “DIS 1000 4.6” (IEC 801.6).
SYMBOL
V_EMC
emission test
immunity test
PARAMETER
CONDITIONS MIN.
note 1
−
note 1
−
TYP.
1.5
2.0
MAX. UNIT
−
mV
−
V
Note
1. Tests are performed with application reference board. Tests with other boards will have different results.
1999 Oct 25
14