AR0134CS_16 Datasheet, PDF (37/38 Pages) ON Semiconductor – 1/3-Inch 1.2 Mp CMOS Digital Image Sensor

Figure 26: 48-pin iLCC Package Drawing
AR0134CS: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Package Dimensions
ILCC48 10x10
CASE 847AE
ISSUE O
DATE 30 DEC 2014
Notes:
1. Dimensions in mm. Dimensions in () are for reference only.
2 _{Encapsulant: Epoxy.}
3 _{Substrate material: Plastic laminate 0.5 thickness.}
4 _{Lid material: Borosilicate glass 0.4 ± 0.04 thickness.}
Refractive index at 20C = 1.5255 @ 546nm and 1.5231 @ 588nm.
Double side AR Coating: 530-570nm R< 1%; 420-700nm R < 2%.
5 _{Lead finish: Gold plating, 0.5 microns minimum thickness.}
6 _{Image sensor die: 0.2mm thickness.}
7 _{Maximum rotation of optical area relative to package edges: 1°.}
Maximum tilt of optical area relative to substrate plane ^D : 25 m.
Maximum tilt of cover glass relative to optical area plane ^E : 50 m.
AR0134CS/D Rev. 8, Pub. 1/16 EN
37
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