AR0134CS_16 Datasheet, PDF (36/38 Pages) ON Semiconductor – 1/3-Inch 1.2 Mp CMOS Digital Image Sensor

AR0134CS: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Package Dimensions
Package Dimensions
Figure 25: 63-Ball iBGA Package Outline Drawing
IBGA63 9x9
CASE 503AG
ISSUE O
DATE 30 DEC 2014
Notes:
1. Dimensions in mm. Dimensions in () are for reference only.
2 _{Encapsulant: Epoxy.}
3 _{Substrate material: Plastic laminate 0.25 thickness.}
4 _{Lid material: Borosilicate glass 0.4 ± 0.04 thickness.}
Refractive index at 20C = 1.5255 @ 546nm and 1.5231 @ 588nm.
Double side AR Coating: 530-570nm R< 1%; 420-700nm R < 2%.
5 _{Image sensor die: 0.2mm thickness.}
6 _{Solder ball material: SAC305 (95% Sn, 3% Ag, 0.5% Cu).}
Dimensions apply to solder balls post reflow.
Pre-flow ball is0.5 on a Ø0.4 SMD ball pad.
7 _{Maximum rotation of optical area relative to package edges: 1°.}
Maximum tilt of optical area relative to substrate plane ^D : 25 m.
Maximum tilt of cover glass relative to optical area plane ^E : 50 m.
AR0134CS/D Rev. 8, Pub. 1/16 EN
36
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