TDA8296 Datasheet, PDF (53/87 Pages) NXP Semiconductors – Digital global standard low IF demodulator for analog TV and FM radio

NXP Semiconductors
TDA8296
Digital global standard low IF demodulator for analog TV and FM radio
10. Limiting values
Table 62. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).^[1][2][3]
Symbol
Parameter
Conditions
V_DDD(1V2)
V_DDDR(3V3)
V_{DDA(ADC)(1V2)}
V_{DDA(PLL)(1V2)}
V_{DDA(DAC)(3V3)}
V_i
digital supply voltage (1.2 V)
ring digital supply voltage (3.3 V)
ADC analog supply voltage (1.2 V)
PLL analog supply voltage (1.2 V)
DAC analog supply voltage (3.3 V)
input voltage
pins XIN, IF_POS and
IF_NEG
digital input pins
T_lead
P_tot
T_stg
T_j
T_amb
V_ESD
lead temperature
total power dissipation
storage temperature
junction temperature
ambient temperature
electrostatic discharge voltage
T_amb = 85 °C
all pins:
Field ind. Charge Device
Model (FCDM)
Human Body Model (HBM)
Min
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
-
-
−40
-
−20
[4] _-
-
Max
Unit
+1.5
V
+4.6
V
+1.5
V
+1.5
V
+4.6
V
+1.3
V
+4.6
V
300
°C
0.5
W
+125 °C
+125 °C
+85
°C
±1000 V
±4000 V
[1] Stresses above the absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
[2] T_j depends on the assembly condition of the package and especially on the design of the PCB. The application mounting must be done
in such a way that the maximum junction temperature T_j(max) is never exceeded.
[3] No power sequence requirement
[4] Class IV according to EIA/JESD22-C101.
11. Thermal characteristics
TDA8296
Product data sheet
Table 63.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
ambient
Conditions
in still air
Typ
Unit
36.8 K/W
The thermal resistance depends strongly on the nature of the PCB used in the application
and on its design. The thermal resistance given in Table 63 corresponds to the value that
can be measured on a multilayer PCB (4 layers) as defined by EIA/JESD51-2. This value
is given for information only.
The junction temperature influences strongly the reliability of an IC. The PCB used in the
application contributes on a large part to the overall thermal characteristic. It must
therefore be designed to insure that the junction temperature of the IC never exceeds
T_j(max) = 125 °C at the maximum ambient temperature.
The IC has to be soldered to ground with its die-attached paddle. Plenty of vias are
recommended to remove the heat.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 3 March 2011
© NXP B.V. 2011. All rights reserved.
53 of 87