TDA8025 Datasheet, PDF (33/38 Pages) NXP Semiconductors – IC card interface

NXP Semiconductors
13. Package outline
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
D
BA
TDA8025
IC card interface
SOT617-1
terminal 1
index area
A
A1
E
c
detail X
e1
C
e
1/2 e b
vMC A B
y1 _C
y
9
16
wM C
L
17
8
e
Eh
e2
1/2 e
1
24
terminal 1
index area
32
25
Dh
X
0
2.5
DIMENSIONS (mm are the original dimensions)
scale
UNIT ^A(1)
max.
A1
b
c
D⁽¹⁾ Dh E⁽¹⁾ Eh
e
e1 e2
mm
1
0.05 0.30
0.00 0.18
0.2
5.1
4.9
3.25
2.95
5.1
4.9
3.25
2.95
0.5
3.5 3.5
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT617-1
---
MO-220
---
5 mm
L
v
w
y y1
0.5
0.3
0.1 0.05 0.05 0.1
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-18
Fig 19. Package outline SOT617-1
TDA8025_1
Product data sheet
Rev. 01 — 6 April 2009
© NXP B.V. 2009. All rights reserved.
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