TDA8025 Datasheet, PDF (22/38 Pages) NXP Semiconductors – IC card interface

NXP Semiconductors
TDA8025
IC card interface
9. Limiting values
Remark: All card contacts are protected against any short-circuit to any other card
contact. Stress beyond the levels indicated in Table 6 can cause permanent damage to
the device. This is a short-term stress rating only and under no circumstances implies
functional operation under long-term stress conditions.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
V_DDI(REG)
regulator input supply voltage
−0.3
+5.5
V
V_DD(INTREGD) internal regulated supply voltage
−0.3
+5.5
V
V_I
input voltage
pins CMDVCCN, TEST1, TEST2,
−0.3
+5.5
V
CLKDIV2, CLKDIV1, VCC_SEL1,
VCC_SEL2, CONFIG, RSTIN,
OFFN, TEST3, PORADJ, ENCLKIN,
XTAL2, XTAL1, I/OUC, AUX1UC and
AUX2UC
card contact pins PRES, PRESN,
−0.3
+6.5
V
I/O, RST, AUX1, AUX2 and CLK
T_stg
P_tot
T_j
T_amb
V_ESD
storage temperature
−55
+150
°C
total power dissipation
T_amb = −25 °C to +85 °C
-
0.56
W
junction temperature
-
150
°C
ambient temperature
−25
+85
°C
electrostatic discharge voltage
pins I/O, RST, V_CC, AUX1, CLK,
−6
+6
kV
AUX2, PRES and PRESN; within
typical application
Human Body Model (HBM); all pins; −2
+2
kV
EIA/JESD22-A114-B, June 2000
Machine Model (MM); all pins;
−200
+200
V
EIA/JESD22-A115-A, October 1997
Charged Device Model (CDM);
all pins, except corner pins
−500
+500
V
only corner pins (1, 8, 9, 16, 17,
−750
+750
V
24, 25 and 32)
10. Thermal characteristics
Table 7.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Conditions
with exposed pad soldered
without exposed pad soldered
Typ Unit
42 K/W
62 K/W
TDA8025_1
Product data sheet
Rev. 01 — 6 April 2009
© NXP B.V. 2009. All rights reserved.
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