English
Language : 

TDA8025 Datasheet, PDF (27/38 Pages) NXP Semiconductors – IC card interface
NXP Semiconductors
TDA8025
IC card interface
Table 8. Characteristics of IC supply voltage …continued
Tamb = 25 °C; all parameters remain within limits but are only statistically tested for the temperature range; fxtal = 10 MHz; all
currents flowing into the IC are positive; unless otherwise specified. Parameters specified as a function of
VDD(INTF), VDDI(REG), VDD(INTREGD) or VCC refer to the actual value at the time of measurement.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IOH
HIGH-level
pin I/OUC when active
−1
-
-
mA
output current pull-up; VOH = 0.9VDD;
C = 30 pF
Internal oscillator
fosc(int)
internal oscillator inactive mode
frequency
active mode
55
140
200
1.9
2.7
3.2
kHz
MHz
Reset output to the card: pin RST
Vo
output voltage inactive mode
no load
0
-
0.1
V
Io = 1 mA
-
-
0.3
V
Io
output current when inactive and pin
0
-
−1
mA
RST grounded
td
delay time
between pins RSTIN and
-
-
2
µs
RST; RST enabled
VOL
LOW-level output IOL = 200 µA
0
-
0.2
V
voltage
current limit IOL = 20 mA
VCC − 0.4
-
VCC
V
VOH
HIGH-level
IOH = −200 µA
0.9VCC
-
VCC
V
output voltage current limit IOH = −20 mA
0
-
0.4
V
tr
rise time
CL = 100 pF;
[6] -
-
0.1
µs
VCC = 3 V, 1.8 V or 1.2 V
tf
fall time
CL = 100 pF;
[6] -
-
0.1
µs
VCC = 3 V, 1.8 V or 1.2 V
Clock output to the card: pin CLK
Vo
output voltage inactive mode
no load
0
-
0.1
V
Io = 1 mA
-
-
0.3
V
Io
output current pin CLK when inactive
0
-
−1
mA
and grounded
VOL
LOW-level output IOL = 200 µA
0
-
0.3
V
voltage
current limit IOL = 70 mA
VCC − 0.4
-
VCC
V
VOH
HIGH-level
IOH = −200 µA
0.9VCC
-
VCC
V
output voltage current limit IOH = −70 mA
0
-
0.4
V
tr
rise time
CL = 30 pF
[6] -
-
16
ns
tf
fall time
CL = 30 pF
[6] -
-
16
ns
δ
duty cycle
except for fxtal; CL = 30 pF [6] 45
-
55
%
SR
slew rate
rise and fall; CL = 30 pF;
0.2
-
-
VCC = 3 V or 1.8 V
V/ns
CL = 30 pF; VCC = 1.2 V
0.1
-
-
V/ns
TDA8025_1
Product data sheet
Rev. 01 — 6 April 2009
© NXP B.V. 2009. All rights reserved.
27 of 38