English
Language : 

TDA8025 Datasheet, PDF (29/38 Pages) NXP Semiconductors – IC card interface
NXP Semiconductors
TDA8025
IC card interface
[2] To enable the microcontroller to provide the required maximum voltage input level on XTAL1, VDD(INTF) must not exceed
VDD(INTREGD) + 0.3 V. See Section 8.1 on page 7 for specific limitations on the maximum VDD(INTF) voltage and Table 8 on page 23 for
the limits of XTAL1.
[3] To meet these specifications, VCC should be decoupled to pin CGND using two low ESR, ceramic multilayer capacitors one of 470 nF
and one of 220 nF with an ESR of < 100 mΩ.
[4] Using the internal pull-up resistor to VCC.
[5] Using the internal pull-up resistor to VDD(INTF).
[6] The transition time and the duty factor definitions are shown in Figure 16 on page 30; δ = t1/(t1 + t2).
[7] Pins PRESN and CMDVCCN are active LOW. Pins RSTIN and PRES are active HIGH; see Table 4 on page 12 for pins CLKDIV1 and
CLKDIV2; see Table 5 on page 19 for pins VCC_SEL1 and VCC_SEL2.
[8] If PRESN or PRES is true, the card is considered to be present. A debouncing feature of 4.5 ms typical is built-in.
[9] Pin PRES has an integrated current source to pin GND, pin PRES to VDD(INTREGD); the card is considered as present if at least one of
the two inputs is true.
[10] Pin OFFN is an NMOS drain, using an internal pull-up resistor to VDD(INTREGD).
Table 9.
Symbol
ICC
Protection characteristics
Parameter
supply current
IIO
input/output current
Tsd
shutdown temperature
Conditions
shutdown current on
pin VCC
pin VCC
pin CLK
pin RST
pins I/O, AUX1 and
AUX2
Min
Typ
Max
Unit
95
135
185
mA
135
175
225
mA
−70
-
+70
mA
−20
-
+20
mA
−15
-
+15
mA
-
150
-
°C
Table 10. Timing characteristics
Symbol
Parameter
Conditions
Min Typ Max Unit
tact
activation time
total sequence with the crystal oscillator
[1] 35
-
3000 µs
external clock
[2] 35
-
240 µs
tdeact
deactivation time total sequence
[3] 35
80
100 µs
td
delay time
CLK sent to a card with the crystal oscillator
td(start) = t3
[1] 35
-
3000 µs
td(end) = t5
[1] 160
-
3090 µs
CLK sent to card using an external clock
td(start) = t3
td(end) = t5
tdeb
debounce time
on pins PRES and PRESN
[2] 35
-
[2] 160
-
[4] 3.2
4.5
150 µs
240 µs
12
ms
[1] See Figure 8 on page 15.
[2] See Figure 10 on page 16.
[3] See Figure 12 on page 18.
[4] See Figure 15 on page 21.
TDA8025_1
Product data sheet
Rev. 01 — 6 April 2009
© NXP B.V. 2009. All rights reserved.
29 of 38