DSPIC33FJ32GS406_12 Datasheet, PDF (23/456 Pages) Microchip Technology – 16-Bit Digital Signal Controllers with High-Speed PWM, ADC and Comparators

dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
2.0 GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Note 1: This data sheet summarizes the features
of the dsPIC33FJ32GS406/606/608/610
and dsPIC33FJ64GS406/606/608/610
family of devices. It is not intended to
be a comprehensive reference source.
To complement the information in
this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”. Please see the Microchip web
site (www.microchip.com) for the latest
dsPIC33F/PIC24H Family Reference
Manual sections.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
2.1 Basic Connection Requirements
Getting
started
with
the
dsPIC33FJ32GS406/606/608/610
and
dsPIC33FJ64GS406/606/608/610 family of 16-bit
Digital Signal Controllers (DSC) requires attention
to a minimal set of device pin connections before
proceeding with development. The following is a list
of pin names, which must always be connected:
• All VDD and VSS pins
(see Section 2.2 “Decoupling Capacitors”)
• All AVDD and AVSS pins (regardless if ADC module
is not used)
(see Section 2.2 “Decoupling Capacitors”)
• VCAP
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (VCAP)”)
• MCLR pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
• PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
• OSC1 and OSC2 pins when external oscillator
source is used
(see Section 2.6 “External Oscillator Pins”)
2.2 Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD, and
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation of
0.1 µF (100 nF), 10-20V. This capacitor should be a
low-ESR and have resonance frequency in the
range of 20 MHz and higher. It is recommended that
ceramic capacitors be used.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close to
the pins as possible. It is recommended to place the
capacitors on the same side of the board as the
device. If space is constricted, the capacitor can be
placed on another layer on the PCB using a via;
however, ensure that the trace length from the pin to
the capacitor is within one-quarter inch (6 mm) in
length.
• Handling high-frequency noise: If the board is
experiencing high-frequency noise, upward of tens
of MHz, add a second ceramic-type capacitor in par-
allel to the above described decoupling capacitor.
The value of the second capacitor can be in the
range of 0.01 µF to 0.001 µF. Place this second
capacitor next to the primary decoupling capacitor.
In high-speed circuit designs, consider implement-
ing a decade pair of capacitances as close to the
power and ground pins as possible. For example,
0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first, and
then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB track inductance.
 2009-2012 Microchip Technology Inc.
DS70591E-page 23