PIC24FJ128GA010_09 Datasheet, PDF (229/240 Pages) Microchip Technology – 64/80/100-Pin General Purpose, 16-Bit Flash Microcontrollers

PIC24FJ128GA010 FAMILY
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
e
E1
E
b
N
α
NOTE 1 _{1 2 3}
NOTE 2 A
c
β
φ
A2
A1
L
L1
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
N
100
e
0.50 BSC
A
–
–
1.20
A2
0.95
1.00
1.05
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
A1
0.05
–
0.15
L
0.45
0.60
0.75
L1
1.00 REF
φ
0°
3.5°
7°
E
16.00 BSC
D
16.00 BSC
Molded Package Width
Molded Package Length
Lead Thickness
E1
14.00 BSC
D1
14.00 BSC
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-110B
© 2009 Microchip Technology Inc.
DS39747E-page 229