PIC16F636-I Datasheet, PDF (222/234 Pages) Microchip Technology – 8/14-Pin, Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC12F635/PIC16F636/639
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D2
EXPOSED
PAD
e
E
E2
2
2
b
1
1
N
TOP VIEW
NOTE 1
N
BOTTOM VIEW
K
L
A
A3
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
Number of Pins
N
16
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
Standoff
A1
0.00
0.02
Contact Thickness
A3
0.20 REF
Overall Width
E
4.00 BSC
Exposed Pad Width
E2
2.50
2.65
Overall Length
D
4.00 BSC
Exposed Pad Length
D2
2.50
2.65
Contact Width
b
0.25
0.30
Contact Length
L
0.30
0.40
Contact-to-Exposed Pad
K
0.20
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
MAX
1.00
0.05
2.80
2.80
0.35
0.50
–
Microchip Technology Drawing C04-127B
DS41232D-page 220
© 2007 Microchip Technology Inc.