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PIC32MX3XX_1 Datasheet, PDF (160/208 Pages) Microchip Technology – High-Performance, General Purpose and USB 32-bit Flash Microcontrollers
PIC32MX3XX/4XX
TABLE 29-11: PROGRAM FLASH MEMORY WAIT STATE CHARACTERISTICS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
Required Flash wait states
SYSCLK
Units
Comments
0 Wait State
1 Wait State
0 to 30
MHz
31 to 60
—
2 Wait States
61 to 80
Note 1: 40 MHz maximum for PIC32MX320F032H and PIC32MX420F032H devices.
TABLE 29-12: COMPARATOR SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature-40°C ≤ TA ≤ +85°C for Industrial
Param.
No.
Symbol
Characteristics
Min. Typical Max. Units
Comments
D300 VIOFF Input Offset Voltage
— ±7.5 ±25 mV
AVDD = VDD,
AVSS = VSS
D301 VICM
Input Common Mode Voltage
0
—
VDD
V
AVDD = VDD,
AVSS = VSS
(Note 2)
D302 CMRR Common Mode Rejection Ratio 55
—
—
dB
Max VICM = (VDD - 1)V
(Note 2)
D303 TRESP Response Time
—
150 400 nsec
AVDD = VDD,
AVSS = VSS
(Notes 1,2)
D304 ON2OV Comparator Enabled to Output
—
—
10
μs Comparator module is
Valid
configured before setting
the comparator ON bit.
(Note 2)
D305 IVREF Internal Voltage Reference
1.14 1.2 1.26
V
—
Note 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions
from VSS to VDD.
2: These parameters are characterized but not tested.
TABLE 29-13: VOLTAGE REFERENCE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature-40°C ≤ TA ≤ +85°C for Industrial
Param.
No.
Symbol
Characteristics
Min. Typical Max. Units
Comments
D310 VRES
Resolution
VDD/24 — VDD/32 LSb
—
D311
D312
VRAA
TSET
Absolute Accuracy
Settling Time(1)
—
—
1/2 LSb
—
—
—
10
μs
—
Note 1: Settling time measured while CVRR = 1 and CVR3:CVR0 transitions from ‘0000’ to ‘1111’. This
parameter is characterized, but not tested in manufacturing.
DS61143G-page 160
© 2010 Microchip Technology Inc.