PIC32MX3XX_1 Datasheet, PDF (155/208 Pages) Microchip Technology – High-Performance, General Purpose and USB 32-bit Flash Microcontrollers

PIC32MX3XX/4XX
TABLE 29-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
Parameter
No.
Typical⁽³⁾
Max.
Units
Conditions
Operating Current (IDD)^(1,2)
DC20
8.5
13
DC20c
4.0
—
mA Code executing from Flash
—
mA Code executing from SRAM
—
4 MHz
DC21
DC21c
23.5
32
16.4
—
mA
Code executing from Flash
—
mA Code executing from SRAM
—
20 MHz
(Note 4)
DC22
DC22c
DC23
DC23c
48
61
mA
Code executing from Flash
—
60 MHz
45
—
mA Code executing from SRAM
—
(Note 4)
55
75
mA
Code executing from Flash
2.3V
80 MHz
55
—
mA Code executing from SRAM
—
DC24
—
100
µA
-40°C
DC24a
—
130
µA
+25°C
2.3V
DC24b
—
670
µA
+85°C
DC25
94
—
µA
-40°C
DC25a
DC25b
125
—
µA
302
—
µA
+25°C
+85°C
3.3V
LPRC (31 kHz)
(Note 4)
DC25c
DC26
71
—
µA
Code executing from SRAM
—
110
µA
-40°C
DC26a
—
180
µA
+25°C
3.6V
DC26b
—
700
µA
+85°C
Note 1:
2:
3:
4:
A device’s IDD supply current is mainly a function of the operating voltage and frequency. Other factors,
such as PBCLK (Peripheral Bus Clock) frequency, number of peripheral modules enabled, internal code
execution pattern, execution from program Flash memory vs. SRAM, I/O pin loading and switching rate,
oscillator type as well as temperature can have an impact on the current consumption.
The test conditions for IDD measurements are as follows: Oscillator mode = EC+PLL with OSC1 driven by
external square wave from rail to rail and PBCLK divisor = 1:8. CPU, Program Flash and SRAM data
memory are operational, Program Flash memory Wait states = 7, program cache and prefetch are dis-
abled and SRAM data memory Wait states = 1. All peripheral modules are disabled (ON bit = 0). WDT and
FSCM are disabled. All I/O pins are configured as inputs and pulled to VSS. MCLR = VDD.
Data in “Typical” column is at 3.3V, 25°C at specified operating frequency unless otherwise stated.
Parameters are for design guidance only and are not tested.
This parameter is characterized, but not tested in manufacturing.
© 2010 Microchip Technology Inc.
DS61143G-page 155