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ISL35822 Datasheet, PDF (60/75 Pages) Intersil Corporation – Octal 2.488Gbps to 3.187Gbps/ Lane Retimer
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ISL35822
Electrical Characteristics
Absolute Maximum Ratings
Table 102. ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN
MAX
UNITS
VDDPR
2.5V Protection Power Supply Voltage
-0.5,
2.6,
V
VDD - 0.5
VDD + 2.0
VDDA, VDD, VDDAC, All Other Power Supply Voltages
VDDAV
-0.5
1.65
V
V INCML
CML DC Input Voltage
-0.5
VDD + 0.5
V
IOUTCML
CML Output Current
- 50
+50
mA
V INCMS1
1.2V CMOS Input Voltage
-0.5
VDD + 0.5
V
V INCMS2
1.5V CMOS Input Voltage
-0.5
VDD + 0.5
V
V INCMS3
2.5V Tolerant CMOS Input Voltage
-0.5
2.6
V
Tstg
Storage Temperature
- 55
125
°C
Tj
Junction Temperature
- 55
125
°C
TSOL
Soldering Temperature (10s)
220
°C
V ESD
Maximum Input ESD (HBM)
-2000
2000
V
Note (1): These ratings are those which if exceeded may cause permanent damage to the device. Operation at these or any other conditions in excess of those listed
under Operating Conditions below is not implied. Continued exposure to these ratings may reduce device reliability.
Operating Conditions
All Standard Device specifications assume TC = 0°C to +85°C, VDDAC = VDDAV = VDD = VDDA = 1.5V ± 5%, VDDPR = VDD or 2.4V ± 0.1V, unless
otherwise specified.
The Low Power Device specifications assume TC = 0°C to +85°C, VDDAC = VDDAV = VDD = VDDA = 1.355V ± 4%, VDDPR = VDD or 2.4V ± 0.1V,
unless otherwise specified.
Table 103. RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
MIN
NOM
MAX
UNITS
VDDA VDDAV,
VDDAC & VDD
VDDPR
TA
TC
Core and Serial I/O Power Supply
Voltages
(Standard Device)
(Low Power Device)
Control I/O Protection Power Supply Voltage
Ambient Operating Temperature(2)
Case Operating Temperature
1.425
1.5
1.575
V
1.300
1.355
1.410
V
VDD
(1)
2.5
V
0
25
+70
°C
0
+85
°C
Note (1): The VDDPR supply should be tied to a level at or above VDD, and at the highest level expected on any “2.5V tolerant” control pin, consistent with the above
ratings.
Note (2): For reference only. All testing is performed based on Case Temperature.
SYMBOL
PD
Table 104. POWER DISSIPATION AND THERMAL RESISTANCE
Power Dissipation(2)
PARAMETER
(Standard Device, CX4 Mode)
TYP(1)
1650
MAX(1)
1830
UNITS
mW
(Low Power Device, LX4 Mode)
1250
1350
mW
θJC
Thermal Resistance, Junction to Case
2.0
°C/W
θCA
Thermal Resistance, Case to Ambient (still air, gap filler & cold plate)
13.0
°C/W
θCA
Thermal Resistance, Case to Ambient (still air only)
31.0
°C/W
Note (1): The ‘Max’ value is at the maximum supply voltages, while the ‘Typ’ value is at the nominal supply voltages. The power dissipation is not significantly affected
by the VDDPR supply (see Table 111 for the distribution of power between the supplies). The “Mode” setting is assumed to be the default for that mode.
Note (2): The operating power varies slightly with the data pattern. The part is tested using the PRBS23 (223-1 byte) pattern.
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