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ISL6323A Datasheet, PDF (34/35 Pages) Intersil Corporation – Monolithic Dual PWM Hybrid Controller Powering AMD SVI Split-Plane and PVI Uniplane Processors
ISL6323A
RAPA
CAPA
C2
RCCC
FB
COMP
ISEN3+
ISEN3-
PWM3
RFB
VSEN
BOOT1
UGATE1
PHASE1
APA
DVC
LGATE1
ISEN1-
ISEN1+
+5V
CFILTER
VCC
OFS
ROFS
PVCC1_2
BOOT2
UGATE2
FS
+5V RFS
PHASE2
RSET
RSET
LGATE2
VFIXEN
SEL
SVD
ISEN2-
ISEN2+
SVC
NC VID4
NC VID5
PWROK
RGND
VDDPWRGD ISEN4+
GND
ISEN4-
+12V
CIN
CBOOT
R1_1 C1
R1_2
+12V
R3_2
C3 R3_1CIN
CBOOT
BOOT1
UGATE1
PHASE1
LGATE1
PGND PWM1
+12V
ISL6614 +12V
CFILTER
CBOOT
V_CORE
CIN
CIN
CBULK CHF
+12V
VCC
BOOT2 PVCC
CBOOT
UGATE2 GND
CFILTER
R2_1 C2
CPU
LOAD
C4 R4_1
PHASE2
PWM2
LGATE2
R2_2
R4_2
PWM4
+12V
ISL6323A
+12V
REN1
PVCC_NB
OFF
EN
CFILTER
CIN
ON
REN2
BOOT_NB
CBOOT_NB
UGATE_NB
KEY
HEAVY TRACE ON CIRCUIT PLANE LAYER
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
VIA CONNECTION TO GROUND PLANE
PHASE_NB
LGATE_NB
ISEN_NB-
ISEN_NB+
COMP_NB
FB_NB
RC_NB
CC_NB
RFB_NB
R1_NB C1_NB
R2_NB
V_NB
CHF
CBULK
NB
LOAD
RED COMPONENTS:
LOCATE CLOSE TO IC TO
MINIMIZE CONNECTION PATH
BLUE COMPONENTS:
LOCATE NEAR LOAD
(MINIMIZE CONNECTION PATH)
MAGENTA COMPONENTS:
LOCATE CLOSE TO SWITCHING TRANSISTORS
(MINIMIZE CONNECTION PATH)
FIGURE 28. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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FN6878.0