HYB18L128160BF Datasheet, PDF (52/53 Pages) Infineon Technologies AG – DRAMs for Mobile Applications

4
Package Outlines
HY[B/E]18L128160B[C/F]-7.5
128-Mbit Mobile-RAM
Package Outlines
8 x 0.8 = 6.4
0.8
0.3 D
5)
D
4)
B
0.12
+0.01
-0.04
20˚±5˚
4)
2)
A
3) 1)
0.1 C
0.1 C
0.41 ±0.03
54x
ø0.12 M
ø0.07 M
C
A
B
1.5 ²⁾
4.25
C SEATING PLANE
0.2
12
1) A1 Marking Ballside
2) Die Sort Fiducial
3) Bad Unit Marking (BUM)
4) Middle of Packages Edges
5) Middle of Ball Matrix
Figure 47 P-VFBGA-54-2 (Plastic Very Thin Fine Ball Grid Array Package)
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
SMD = Surface Mounted Device
Data Sheet
48
Dimensions in mm
V1.4, 2004-04-30