XC2269I Datasheet, PDF (130/134 Pages) Infineon Technologies AG – 16/32-Bit Single-Chip Microcontroller

XC2269I
XC2000 Family Derivatives / Premium Line
Package and Reliability
5
Package and Reliability
The XC2000 Family devices use the package type PG-LQFP (Plastic Green - Low
Profile Quad Flat Package). The following specifications must be regarded to ensure
proper integration of the XC2269I in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 46 Package Parameters (PG-LQFP-100-8/-15)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension Ex × Ey –
7.5 × 7.5 mm –
Thermal resistance
Junction-Ambient
R_ΘJA
–
23
K/W 4-layer,
pad soldered¹⁾
1) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
Using this device without the exposed pad soldered or on boards without thermal vias is not recommended.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Usage in High-Performance Applications
The XC2269I can deliver a high performance to the system. In some cases additional
measures are required to remove the heat from the device.
This may be necessary if the XC2269I is supplied with V_DDP = 5 V and is operated at a
high system frequency in a hot environment.
Applications with V_DDP = 3.3 V usually require no extra measures.
Package Compatibility Considerations
The XC2269I is a member of the XC2000 Family of microcontrollers. It is also compatible
to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Data Sheet
130
V1.3, 2014-07