STAC9766 Datasheet, PDF (92/97 Pages) Integrated Device Technology – TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING

STAC9766/9767
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING
PC AUDIO
15.SOLDER REFLOW PROFILE
15.1. Standard Reflow Profile Data
Note: These devices can be hand soldered at 360 ^oC for 3 to 5 seconds.
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount
Devices” (www.jedec.org/download).
Profile Feature
Average Ramp-Up Rate (Ts_max - Tp)
Preheat
Temperature Min (Ts_min)
Temperature Max
(Ts_max)
Time (ts_min - ts_max)
Time maintained above
Temperature (T_L)
Time (t_L)
3 ^oC / second max
150 ^oC
200 ^oC
60 - 180 seconds
217 ^oC
60 - 150 seconds
Pb Free Assembly
Peak / Classification Temperature (Tp) ^{See “Package Classification Reflow Temperatures”}
on page 93.
Time within 5 ^oC of actual Peak Temperature (tp) _{20 - 40 seconds}
Ramp-Down rate ₆ ^o_{C / second max}
Time 25 ^oC to Peak Temperature _{8 minutes max}
Note: All temperatures refer to topside of the package, measured on the package body surface.
Figure 26. Solder Reflow Profile
IDT™
92
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING
STAC9766/9767
V 7.4 12/06