HDMP-1012 Datasheet, PDF (23/42 Pages) Agilent(Hewlett-Packard) – 4Low Cost Gigabit Rate Transmit/Receive Chip Set

Mechanical Dimensions
and Surface Mount
Assembly
Recommendations
Both the HDMP-1012 and HDMP-
1014 are implemented in an
industry standard M-Quad 80
package. The package outline
dimensions conform to JEDEC
plastic QFP specifications and are
shown below in Figure 10. The M-
Quad 80 package material is
aluminum and the leads have
been formed into a “Gull-Wing”
configuration for surface
mounting.
We recommend keeping the
package temperature, Tc, below
75°C. Forced air cooling may be
required.
M-Quad 80 Package Information
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Coplanarity
Details
Aluminum
85/15 Sn/Pb
300 - 600 µ inches
0.004 inches maximum
PIN #1 ID
TOP VIEW
+0.18
19.786 _-0.08
(0.779
+0.008
-0.002
)
23.20 ± 0.10
(0.913 ± 0.004)
+0.16
13.792 _-0.04
(0.543
+0.008
-0.002
)
17.20 ± 0.10
(0.677 ± 0.004)
ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2.64 ± 0.13
(0.104 ± 0.005)
0.35 TYP.
(0.014 TYP.)
0.80 TYP.
(0.0315 TYP.)
Figure 10. Mechanical Dimensions of HDMP-1012 and HDMP-1014.
0.15
(0.006)
7 DEG
0.80 ± 0.13
(0.031 ± 0.005)
0.38 ± 0.05
(0.015 ± 0.002)
595