MB85RS2MTPF-G Datasheet, PDF (25/28 Pages) Fujitsu Component Limited. – 2 M (256 K × 8) Bit SPI

(Continued)
8-pin plastic DIP
MB85RS2MT
Lead pitch
Sealing method
2.54 mm
Plastic mold
(DIP-8P-M03)
8-pin plastic DIP
(DIP-8P-M03)
9.40
+0.40
–0.30
.370
+.016
–.012
8
5
INDEX
6.35±0.25
(.250±.010)
1
4
7.62(.300)
TYP.
4.36(.172)MAX
0.50(.020)
MIN
3.00(.118)MIN
0.25±0.05
(.010±.002)
0.89
+0.35
–0.30
.035
+.014
–.012
0.99
+0.30
–0
.039
+.012
–0
0.46±0.08
(.018±.003)
1.52
+0.30
–0
.060
+.012
–0
2.54(.100)
TYP.
C _{2006-2010 FUJITSU SEMICONDUCTOR LIMITED D08008S-c-1-4}
15° MAX
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
DS501-00023-0v01-E
25