MB85RS2MTPF-G Datasheet, PDF (21/28 Pages) Fujitsu Component Limited. – 2 M (256 K × 8) Bit SPI

MB85RS2MT
■ MB85RS2MTPF (8-pin plastic SOP) REFLOW CONDITIONS AND FLOOR LIFE
Item
Method
Times
Floor life
Floor life condition
Reflow Profile
Condition
IR (infrared reflow) , Convection
2
Before unpacking
Please use within 2 years after production.
From unpacking to 2nd reflow
Within 8 days
In case over period of floor life
Baking with 125 °C+/-3 °C for
24hrs+2hrs/-0hrs is required.
Then please use within 8 days.
(Please remember baking is up to 2 times)
Between 5 °C and 30 °C and also below 70%RH required.
(It is preferred lower humidity in the required temp range.)
260°C
255°C
Liquidous
Temperature
170 °C
to
190 °C
RT
(b)
(a)
(c) (d)
(e)
(d')
(a) Average ramp-up rate
(b) Preheat & Soak
(c) Average ramp-up rate
(d) Peak temperature
(d’) Liquidous temperature
(e) Cooling
: 1 °C/s to 4 °C/s
: 170 °C to 190 °C, 60 s to 180 s
: 1 °C/s to 4 °C/s
: Temperature 260 °C Max; 255 °C within 10 s
: Up to 230 °C within 40 s or
Up to 225 °C within 60 s or
Up to 220 °C within 80 s
: Natural cooling or forced cooling
Note : Temperature on the top of the package body is measured.
DS501-00023-0v01-E
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