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PXS20 Datasheet, PDF (93/119 Pages) Freescale Semiconductor, Inc – PXS20 Microcontroller
Electrical characteristics
4 During the sample time the input capacitance CS can be charged/discharged by the external source. The internal resistance
of the analog source must allow the capacitance to reach its final voltage level within tsample. After the end of the sample time
tsample, changes of the analog input voltage have no effect on the conversion result. Values for the sample clock tsample
depend on programming.
5 This parameter does not include the sample time tsample, but only the time for determining the digital result and the time to
load the result register with the conversion result.
6 See Figure 9.
7 For the 144-pin package.
8 No missing codes.
3.16 Flash memory electrical characteristics
Table 24. Flash memory program and erase electrical specifications
No.
Symbol
Parameter
Min
Typ1
Factory
Avg2
Initial
Max3
Lifetime
Max4
Unit
1 TDWPROGRAM *5 Double word (64 bits) program time6
— 39 — — 500 µs
2 TPPROGRAM *5 Page(128 bits) program time6
— 48 53 100 500 µs
3 T16KPPERASE *5 16 KB block pre-program and erase time
— TBD TBD 500 5000 ms
4 T48KPPERASE *5 48 KB block pre-program and erase time
— TBD TBD 750 5000 ms
5 T64KPPERASE *5 64 KB block pre-program and erase time
— TBD TBD 900 5000 ms
6 T128KPPERASE *5 128 KB block pre-program and erase time
— TBD TBD 1300 7500 ms
7 T256KPPERASE *5 256 KB block pre-program and erase time
— TBD TBD 2600 15000 ms
1 Typical program and erase times assume nominal supply values and operation at TJ = 25 °C. These values are
characterized, but not tested.
2 Factory Average program and erase times represent the effective performance averaged over > 1024 pages or blocks,
and are provided for factory throughput estimation assuming < 100 program/erase cycles, nominal supply values and
operation at TJ = 25 °C. These values are characterized, but not tested.
3 Initial Max program and erase times provide guidance for time-out limits used in the factory and apply for < 100
program/erase cycles, nominal supply values and operation at TJ = 25 °C. These values are verified at production test.
4 Lifetime Max program and erase times apply across the voltage, temperature, and cycling range of product life. These
values are characterized, but not tested.
5 See Notes for individual specifications, as shown in column headings.
6 Actual hardware programming times. These do not include software overhead.
Table 25. Flash memory timing
Symbol
Parameter
Min
TRES D Time from clearing the MCR-ESUS or PSUS bit with EHV = 1 —
until DONE goes low
TDONE D Time from 0 to 1 transition on the MCR-EHV bit initiating a
—
program/erase until the MCR-DONE bit is cleared
Value
Unit
Typ
Max
—
100 ns
—
5
ns
PXS20 Microcontroller Data Sheet, Rev. 1
Freescale Semiconductor
93
Preliminary—Subject to Change Without Notice