PXS20 Datasheet, PDF (75/119 Pages) Freescale Semiconductor, Inc – PXS20 Microcontroller

Electrical characteristics
Table 9. Recommended operating conditions (3.3 V) (continued)
Symbol
Parameter
Conditions Min
Max¹ Unit
V_{SS_LV_REGCOR4} SR Internal reference voltage
V_{DD_LV_CORx}² SR Internal supply voltage
V_{SS_LV_CORx}³ SR Internal reference voltage
V_{DD_LV_PLL2} SR Internal supply voltage
V_{SS_LV_PLL3} SR Internal reference voltage
—
0
0
V
—
—
—
V
—
0
0
V
—
—
—
V
—
0
0
V
T_A
SR Ambient temperature under bias
f_CPU  120 MHz –40
125 °C
T_J
SR Junction temperature under bias
—
–40
150 °C
1 _{Full functionality cannot be guaranteed when voltage drops below 3.0 V. In particular, ADC electrical characteristics}
and I/Os DC electrical specification may not be guaranteed.
2 _{VDD_HV_ADR0 and VDD_HV_ADR1 cannot be operated at different voltages, and need to be supplied by the same}
voltage source.
3 _{Can be connected to emitter of external NPN. Low voltage supplies are not under user control. They are produced}
by an on-chip voltage regulator.
4 _{For the device to function properly, the low voltage grounds (VSS_LV_xxx) must be shorted to high voltage grounds}
(V_{SS_HV_xxx}) and the low voltage supply pins (V_{DD_LV_xxx}) must be connected to the external ballast emitter, if one
is used.
3.4 Thermal characteristics
Table 10. Thermal characteristics for 144 LQFP package¹
Symbol
Parameter
Conditions
Value Unit
R_JA
D Thermal resistance, junction-to-ambient natural Single layer board – 1s
convection²
Four layer board – 2s2p
42 °C/W
34
R_JMA D Thermal resistance, junction-to-ambient forced Single layer board – 1s
convection at 200 ft/min
Four layer board – 2s2p
34 °C/W
28
R_JB D Thermal resistance junction-to-board³
—
22 °C/W
R_JC D Thermal resistance junction-to-case⁴
—
8 °C/W
_JT D Junction-to-package-top natural convection⁵
—
3 °C/W
1 _{Thermal characteristics are targets based on simulation that are subject to change per device characterization.}
2 _{Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board}
meets JEDEC specification for this package.
3 _{Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC}
specification for the specified package.
4 _{Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate}
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
5 _{Thermal characterization parameter indicating the temperature difference between the package top and the}
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
PXS20 Microcontroller Data Sheet, Rev. 1
Freescale Semiconductor
75
Preliminary—Subject to Change Without Notice