MC9S12K Datasheet, PDF (89/126 Pages) Freescale Semiconductor, Inc – Microcontrollers

Device User Guide — 9S12KT256DGV1/D V01.09
Table A-5 Thermal Package Characteristics¹
Num C
Rating
Symbol Min
Typ
1 T _{Thermal Resistance LQFP112, single sided PCB}²
θ_JA
-
-
Thermal Resistance LQFP112, double sided PCB
2
T _{with 2 internal planes3}
θ_JA
-
-
3 T Thermal Resistance QFP 80, single sided PCB
θ_JA
-
-
4
T
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
θ_JA
-
-
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
Max
54
41
51
41
Unit
o_C/W
o_C/W
o_C/W
o_C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 3.3V/5V I/O pins. All parameters are not always applicable,
e.g. not all pins feature pull up/down resistances.
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