MC9S08SG32 Datasheet, PDF (6/328 Pages) Freescale Semiconductor, Inc – HCS08 Microcontrollers

Revision History
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The following revision history table summarizes changes contained in this document.
Revision
Number
1
2
3
4
5
6
7
Revision
Date
6/2007
10/2007
5/2008
5/2008
03/2009
04/2009
10/2009
Description of Changes
Updated the TPM module, incorporated minor revisions for the T_j, PTxSE slew
rate, FPROT and Appendix B packaging information. -SAMPLES DRAFT-
Qualify Draft includes updates to TPM module and the Electricals appendix.
Also, revised the order numbering information.
Updated some electricals and made some minor grammatical/formatting revi-
sions. Corrected the SPI block module version. Removed incorrect ADC temper-
ature sensor value from the Features section. Updated the package information
with a special mask set identifier.
Added the EMC Radiated Emissions data. Removed the Susceptibility Data.
Updated the Corporate addresses on the back cover.
Added the High Temperature Device Specifications and updated the charts.
Updated ADC characteristics for Temp Sensor Slope to be a range of
25 C–150 C, added Control Timing table row 2 to separate standard characteris-
tics from the AEC Grade 0 characteristics, and included the text, “AEC Grade 0”
to the text of footnote 3 for Table B-1 Device Numbering System. Added notes to
the ADC chapter specifying that, for this device, there are only 16 analog input
pins and consequently no APCTL3 register. Updated the Literature Request
information on the back cover.
Revised Table A-6 DC Characteristics, Row 24 Bandgap Voltage Reference for
AEC Grade 0 from 1.21V to 1.22 V. Removed AEC Grade 0 (red diamond) from
the Table A-9 ICS Frequency Specifications, Row 9 Total deviation of trimmed
DCO output frequency over voltage and temperature so that it is not listed for
AEC Grade 0.
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
This product incorporates SuperFlash^® Technology licensed from SST.
MC9S08SG32 Data Sheet, Rev. 7
6
Freescale Semiconductor