MC9S08SG32 Datasheet, PDF (17/328 Pages) Freescale Semiconductor, Inc – HCS08 Microcontrollers

Section Number
Title
Page
17.3 On-Chip Debug System (DBG) .................................................................................................... 277
17.3.1 Comparators A and B...................................................................................................... 277
17.3.2 Bus Capture Information and FIFO Operation ............................................................... 277
17.3.3 Change-of-Flow Information .......................................................................................... 278
17.3.4 Tag vs. Force Breakpoints and Triggers ......................................................................... 278
17.3.5 Trigger Modes................................................................................................................. 279
17.3.6 Hardware Breakpoints .................................................................................................... 281
17.4 Register Definition ........................................................................................................................ 281
17.4.1 BDC Registers and Control Bits ..................................................................................... 281
17.4.2 System Background Debug Force Reset Register (SBDFR) .......................................... 283
17.4.3 DBG Registers and Control Bits..................................................................................... 284
Appendix A
Electrical Characteristics
A.1 Introduction ....................................................................................................................................289
A.2 Parameter Classification.................................................................................................................289
A.3 Absolute Maximum Ratings...........................................................................................................289
A.4 Thermal Characteristics..................................................................................................................291
A.5 ESD Protection and Latch-Up Immunity .......................................................................................293
A.6 DC Characteristics..........................................................................................................................294
A.7 Supply Current Characteristics.......................................................................................................300
A.8 External Oscillator (XOSC) Characteristics ..................................................................................304
A.9 Internal Clock Source (ICS) Characteristics ..................................................................................306
A.10 Analog Comparator (ACMP) Electricals .......................................................................................307
A.11 ADC Characteristics.......................................................................................................................308
A.12 AC Characteristics..........................................................................................................................314
A.12.1 Control Timing ................................................................................................................314
A.12.2 TPM/MTIM Module Timing ...........................................................................................316
A.12.3 SPI....................................................................................................................................317
A.13 Flash Specifications........................................................................................................................321
A.14 EMC Performance..........................................................................................................................322
A.14.1 Radiated Emissions..........................................................................................................322
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information .....................................................................................................................323
B.1.1 Device Numbering Scheme .............................................................................................324
B.2 Package Information and Mechanical Drawings ...........................................................................324
MC9S08SG32 Data Sheet, Rev. 7
Freescale Semiconductor
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