MC9S08SG32 Datasheet, PDF (324/328 Pages) Freescale Semiconductor, Inc – HCS08 Microcontrollers

Appendix B Ordering Information and Mechanical Drawings
B.1.1 Device Numbering Scheme
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Status
- S = Auto Qualified
- MC = Fully Qualified
Main Memory Type
- 9 = Flash-based
Core
Family
- SG
S 9 S08 SG n E1 C xx R
Memory Size
- 32 Kbytes
- 16 Kbytes
Tape and Reel Suffix (optional)
- R = Tape and Reel
Package Designator
Two letter descriptor (refer to
Table B-2).
Temperature Option
- C = –40 to 85 °C
- V = –40 to 105 °C
- M = –40 to 125 °C
- J = –40 to 140 °C
- W = –40 to 150 °C
Mask Set Identifier — this
field only appears in “Auto
Qualified” part numbers
- Alpha character references
wafer fab.
- Numeric character identifies
mask.
Figure B-1. MC9S08SG32 Device Numbering Scheme
B.2 Package Information and Mechanical Drawings
Table B-2 provides the available package types and their document numbers. The latest package
outline/mechanical drawings are available on the MC9S08SG32 Series Product Summary pages at
http://www.freescale.com.
To view the latest drawing, either:
• Click on the appropriate link in Table B-2, or
• Open a browser to the Freescale^® website (http://www.freescale.com), and enter the appropriate
document number (from Table B-2) in the “Enter Keyword” search box at the top of the page.
MC9S08SG32 Data Sheet, Rev. 7
324
Freescale Semiconductor