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MC35XS3400 Datasheet, PDF (5/45 Pages) Freescale Semiconductor, Inc – Quad High Side Switch (Quad 35mΩ)
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VPWR Supply Voltage Range
Load Dump at 25°C (400ms)
Maximum Operating Voltage
Reverse Battery at 25°C (2 min.)
VPWR(SS)
V
41
28
-18
VDD Supply Voltage Range
Input / Output Voltage
WAKE Input Clamp Current
CSNS Input Clamp Current
HS [0:3] Voltage
Positive
Negative
Output Current(1)
Output Clamp Energy using single-pulse method(2)
ESD Voltage(3)
Human Body Model (HBM) for HS[0:3], VPWR and GND
Human Body Model (HBM) for other pins
Charge Device Model (CDM)
Corner Pins (1, 13, 19, 21)
All Other Pins (2-12, 14-18, 20, 22-24)
THERMAL RATINGS
VDD
-0.3 to 5.5
V
(4)
-0.3 to VDD + 0.3
V
ICL(WAKE)
2.5
mA
ICL(CSNS)
2.5
mA
VHS[0:3]
V
41
-16
IHS[0:3]
6
A
ECL [0:3]
35
mJ
V
VESD1
VESD2
± 8000
± 2000
VESD3
VESD4
± 750
± 500
Operating Temperature
°C
Ambient
Junction
TA
- 40 to 125
TJ
- 40 to 150
Storage Temperature
TSTG
- 55 to 150
°C
THERMAL RESISTANCE
Thermal Resistance(5)
Junction to Case
Junction to Ambient
RθJC
RθJA
°C/ W
<1.0
30
Peak Pin Reflow Temperature During Solder Mounting(6)
TSOLDER
245
°C
Notes
1. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
2. Active clamp energy using single-pulse method (L = 2mH, RL = 0Ω, VPWR = 14V, TJ = 150°C initial).
3. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500Ω), the Machine Model (MM)
(CZAP = 200pF, RZAP = 0Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0pF).
4. Input / Output pins are: IN[0:3], RST, FSI, CSNS, SI, SCLK, CS, SO, FS
5. Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of RθJA can be reached in a real application case (4 layers board).
6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause a malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
35XS3400
5
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