MC35XS3400 Datasheet, PDF (35/45 Pages) Freescale Semiconductor, Inc – Quad High Side Switch (Quad 35mΩ)

PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
The 35XS3400 is packaged in a surface mount power
package intended to be soldered directly on the printed circuit
board.
The 35XS3400 was qualified in accordance with JEDEC
standards J-STD-020C Sn-Pb reflow profile. The maximum
peak temperature during the soldering process should not
exceed 245 for 10 seconds maximum duration.
The AN2469 provides guidelines for Printed Circuit Board
design and assembly.
Analog Integrated Circuit Device Data
Freescale Semiconductor
35XS3400
35