MC35XS3400 Datasheet, PDF (42/45 Pages) Freescale Semiconductor, Inc – Quad High Side Switch (Quad 35mΩ)

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07mm thickness
Cu buried traces thickness 0.035mm
Outline:
76.2mm x 114.3mm board area,
including edge connector for thermal
testing, 74mm x 74mm buried layers
area
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 25. Thermal Resistance Performance
Thermal
Resistance
Area A
(mm²)
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
0
47.63
37.21
53.61
150
42.82
33.14
51.06
R_θJAmn
300
41.23
450
40.07
31.84
30.90
50.36
49.26
600
39.24
30.14
48.57
R_θJA is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
0
100
200
300
400
500
600
Heat spreading area [sqmm]
RJA11
RJA12=RJA21
RJA22
Figure 18. Steady State Thermal Resistance in Dependence on Heat Spreading Area;
1s JEDEC Thermal Test Board with Spreading Areas
35XS3400
42
Analog Integrated Circuit Device Data
Freescale Semiconductor