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MC908JB12DWE Datasheet, PDF (321/332 Pages) Freescale Semiconductor, Inc – MC68HC908JB16 Technical Data
Electrical Specifications
20.11 USB Low-Speed Source Electrical Characteristics
Characteristic(1)
Internal operating frequency
Transition time(2)
Rise time
Fall time
Rise/Fall time matching
Low speed data rate
Symbol
fOP
Conditions
—
Min
Typ
Max Unit
—
6
—
MHz
tR
tF
tRFM
tDRATE
CL = 200 pF
75
—
CL = 600 pF
300
ns
CL = 200 pF
75
—
CL = 600 pF
300
tR/tF
80
—
120
%
1.5 Mbs ± 1.5%
1.4775
676.8
1.500
666.0
1.5225
656.8
Mbs
ns
Source differential driver jitter
To next transition
For paired transitions
tDDJ1
CL = 600 pF
Measured at
–25
—
tDDJ2
crossover point
–10
—
25
ns
10
Receiver data jitter tolerance
To next transition
For paired transitions
tDJR1
CL = 600 pF
Measured at
–75
—
tDJR2
crossover point
–45
—
75
ns
45
Source SEO interval of EOP
tLEOPT
Measured at
crossover point
1.25
—
1.50
µs
Source jitter for differential transition
to SE0 transition(3)
Measured at
crossover point
667
ns
Receiver SEO interval of EOP
Must reject as EOP
Must accept
tLEOPR1
tLEOPR2
Measured at
crossover point
210
670
—
—
—
ns
—
Width of SEO interval during
differential transition
tLST
Measured at
crossover point
—
—
210
ns
Notes:
1. All voltages are measured from local ground, unless otherwise specified. All timings use a capacitive load of 50 pF, unless
otherwise specified. Low-speed timings have a 1.5kΩ pullup to 2.8 V on the D– data line.
2. Transition times are measured from 10% to 90% of the data signal. The rising and falling edges should be smoothly tran-
sitioning (monotonic). Capacitive loading includes 50 pF of tester capacitance.
3. The two transitions are a (nominal) bit time apart.
MC68HC908JB16 — Rev. 1.1
Freescale Semiconductor
Electrical Specifications
Technical Data
321